Surface Tension Gradient Dryer (maragoni)
JST’s Combination Rinse and STG Dryer offers Quick Dump Rinsing (QDR) and IPA vapor drying in a single chamber, eliminating air contact. It effectively dries both hydrophobic and hydrophilic wafers with low particle addition.
Rinsing Capability
Full QDR rinsing includes top sprays, high-flow laminar bottom fill with cascade overflow, and a funneled bottom leading to a quick dump valve for fast draining.
Drying Process
Ambient IPA vapor is generated, mixed with high-purity nitrogen, and delivered to the chamber for drying. Programmable ionized nitrogen is also supplied to minimize particles and surface charges on substrates during the IPA vapor process, creating an inert environment. High-purity heated nitrogen provides the final drying step. An automated pneumatic lid remains closed throughout the drying process to maintain conditions.
Benefits
The STG Dryer reduces damage and particle contamination commonly associated with spin drying. It consumes less IPA than traditional IPA dryers and combines rinsing and drying in one chamber, minimizing cleanroom footprint.
Availability
The combination rinse dryer is available as a standalone module or can be integrated into a JST automated station.