SCRUBBER PLASMA TYPE
TOM 1000
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Plasma-wet scrubber compatible with semiconductor applications
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Gas Processing: PLASMA WET
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Processing Capacity: 300 LPM
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Dimension (Cabinet): 800(W) x 800(D) x 1720(H) mm
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Product Features:
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High-temperature thermal equilibrium plasma
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High decomposition efficiency for PFC gas (99%)
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PFC gas processing using high-temperature plasma ARC, without secondary heat sources (LNG, LPG, etc.)
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Compatible Gases:
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PFC Gases: NF3, SF6, CF4, C2F6, C3F8, etc.
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Flammable Gases: SiH4, DCS, TEOS, H2, PH3, etc.
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Water-soluble Gases: Cl2, HF, HCl, NH3, etc.
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