Horizontal LPCVD Furnace

The design of the SVCS Low Pressure Chemical Vapor Deposition furnaces combines the multiple process capability with the needs of a maximum capacity for full production system (SVcFUR-FP) and high flexibility small scale versions for use in research and pilot production (SVcFUR-RD). It provides an easy-to-maintain, safe and reliable horizontal furnace platform.

The SVCS design is outstanding for high efficiency, minimised footprint and low cost of ownership while offering high process flexibility.

LPCVD Processes

• Silicon nitride
• Low temperature oxide (LTO)
• High temperature oxide (HTO)
• TEOS oxide
• Polysilicon, both with tilt andflat temperature profile
• Doped polysilicon
• Oxynitride

Features and Benefits

• State of the art modular control system; in-house designed, highly tailored and in-house manufactured
• Top notch components always selected for excellent results and trouble free long life of the furnace equipment
• Up to 4 stacked quartz  tube reactor chambers for various procesess
• Multiple methods of vacuum control, heated or unheated
  • Throttling Buttefly Valve – TBV
  • N₂ ballast
  • Vacuum pump control with frequency converter
• Integration of vacuum pump system in cooperation with leading vacuum pump manufacturers
• Advanced water cooling tube level system: no thermal interference between different tubes
• Proprietary designed water cooled flanges
• Contactless fully automated boat-in-tube loading both cantilever or softloading configurations
• Maintenance friendly mechanical design

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