Horizontal LPCVD Furnace
SVCS Low Pressure Chemical Vapor Deposition Furnaces
The design of the SVCS Low Pressure Chemical Vapor Deposition furnaces combines multiple process capability with the need for maximum capacity in full production systems (SVcFUR-FP) and high-flexibility small-scale versions for research and pilot production (SVcFUR-RD). It provides an easy-to-maintain, safe, and reliable horizontal furnace platform.
The SVCS design is outstanding for high efficiency, minimized footprint, and low cost of ownership while offering high process flexibility.
LPCVD Processes
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Silicon nitride
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Low temperature oxide (LTO)
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High temperature oxide (HTO)
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TEOS oxide
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Polysilicon, both with tilt and flat temperature profile
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Doped polysilicon
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Oxynitride
Features and Benefits
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State-of-the-art modular control system; in-house designed, highly tailored, and in-house manufactured
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Top-notch components always selected for excellent results and trouble-free, long life of the furnace equipment
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Up to 4 stacked quartz tube reactor chambers for various processes
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Multiple methods of vacuum control, heated or unheated
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Throttling Butterfly Valve (TBV)
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N₂ ballast
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Vacuum pump control with frequency converter
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Integration of vacuum pump systems in cooperation with leading vacuum pump manufacturers
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Advanced water-cooling tube-level system: no thermal interference between different tubes
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Proprietary-designed water-cooled flanges
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Contactless, fully automated boat-in-tube loading in both cantilever and soft-loading configurations
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Maintenance-friendly mechanical design