Wafer Packing and unpacking
Wafer Packing and unpacking
Wafer Packing and unpacking
- Tabletop unit
- Inserts Separator Automatically.
- Removes Separator Automatically.
- Automatically Senses Wafer or Separator Presence, will identify multiple.
- Over 250 Wafer/Hour Throughput Pack or Unpack!
- Backside Wafer Contact.
- Programmable Load Options
- Works with Conductive and Non-Conductive Separators.
Allows Operators to Perform other Tasks during Operation
Contact US
Office Germany:
Contact: Michael Eckel
Westendstr. 13
93413 Cham
Germany
