JST’s OSPRAY Single Wafer Etching and Stripping System utilizes an automated chemical spray process on a single wafer. The system includes oscillating spray nozzles, adjustable wafer speed (RPM) and precision adjustment of the distance between the nozzles and the surface of the wafer. Its automated dispense from chemical storage reservoir provides repeatible volume and mixing control. Backside rinsing or isolation is also available. The module can be installed in an existing workstation or let JST design one for you.